Sections 1(b) and 44(e): Process coating of semiconductor components for others using thin film synthetic polymers; Section 1(b): Processing and assembling of electronic components for the semiconductor manufacturing industry; Processing and assembly of electronic circuits and parts thereof for others; Processing and assembly of electrical communication components for the semiconductor manufacturing industry; Processing and assembly of electronic machines for use in the semiconductor manufacturing industry; Custom manufacture of machines for manufacturing electronic semiconductor components; Custom manufacture of semiconductor manufacturing machines and parts thereof; Custom manufacture of chemical processing machines and parts thereof; Custom manufacture of metalworking machines and parts thereof; Custom manufacture of plastic processing machines and parts thereof; Custom manufacture of industrial machines used to process physical properties of matter and energy, as well as chemical properties and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for metal surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for semiconductor manufacturing and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for plastic surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for glass surface processing, and parts thereof; Custom manufacture of ion plating apparatus for metal surface processing and parts thereof; Custom manufacture of ion plating apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of ion plating apparatus for plastic surface processing and parts thereof; Custom manufacture of ion plating apparatus for glass surface processing and parts thereof; Custom manufacture of sputtering apparatus for metal surface processing and parts thereof; Custom manufacture of sputtering apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of sputtering apparatus for plastic surface processing and parts thereof; Custom manufacture of sputtering apparatus for glass surface processing and parts thereof; Custom manufacture of etching apparatus for metal surface processing and parts thereof; Custom manufacture of etching apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of etching apparatus for plastic surface processing and parts thereof; Custom manufacture of etching apparatus for glass surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for industrial surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for metal surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of vacuum evaporation apparatus for plastic surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for glass surface processing and parts thereof; Custom manufacture of cleaning apparatus comprising a spray nozzle connected to a liquid carbon dioxide tank, and replacement parts therefore

The mark consists of the word "YOUTEC" in blue font with white shading above a blue horizontal line. Below the horizontal line and in smaller, blue font are the words "SUPPORT AND SERVICE".

Sections 1(b) and 44(e): Electronic components, namely, piezoelectric switches and digital transmitters; Integrated electronic circuits and parts thereof; Power line electrical communication systems for transferring broadband data over electrical power lines comprised of computer hardware, software and modems; Electronic machines for identifying surface thickness of thin film applications to semiconductor components and applying film applications to semiconductor components; Conductive material, namely, semiconductor wafers, light conducting filaments, insulated copper wire; Ionic solutions for providing conductivity for use in semiconductor manufacturing; Conductive material sprays incorporating ionic solutions for use in semiconductor manufacturing; Conductive paste incorporating ionic solutions for use in semiconductor manufacturing

Section 1(b): Electronic components, namely, semiconductor wafers for use in the manufacture of semiconductors; Semiconductor manufacturing apparatus and systems, namely, semiconductor substrates and semiconductor wafers and parts thereof; Chemical processing machines, namely, separating machines, dissolving machines, extracting machines and parts thereof; Metalworking machines, namely, boring machines, bending machines, cutting machines and parts thereof; Plastic processing machines and parts thereof; Chemical processing machines for industrial use and parts thereof; Apparatus for forming thin film coatings for use in the manufacture of semiconductors and for processing metal surfaces and insulating materials, and parts thereof; Apparatus for depositing thin film coatings on metal surfaces by chemical vapor deposition processing and parts thereof; Apparatus for forming thin films for use in the manufacture of semiconductors using a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on plastic surfaces through a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on glass surfaces by a chemical vapor deposition process, and parts thereof; Industrial apparatus for processing ion plating applications of metal surfaces and parts thereof; Industrial apparatus for processing ion plating applications for use in semiconductor manufacturing and parts thereof; Industrial apparatus for processing ion plating applications for plastic surfaces, and parts thereof; Industrial apparatus for processing ion plating applications for glass surfaces, and parts thereof; Sputtering apparatus for metal surface processing and parts thereof, for industrial use; Sputtering apparatus for semiconductor manufacturing and parts thereof; Sputtering apparatus for plastic surface processing and parts thereof, for industrial use; Sputtering apparatus for glass surface processing and parts thereof, for industrial use; Etching apparatus for metal surface processing and parts thereof, for industrial use; Etching apparatus for semiconductor manufacturing and parts thereof; Etching apparatus for plastic surface processing and parts thereof, for industrial use; Etching apparatus for glass surface processing and parts thereof, for industrial use; Vacuum evaporation apparatus for surface treatment of semiconductors and parts thereof; Vacuum evaporation processing apparatus for treatment of metal surfaces of semiconductor components, and parts thereof; Vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Vacuum evaporation apparatus for plastic surface processing of semiconductor components, and parts thereof; Vacuum evaporation processing apparatus for use on glass surfaces of semiconductor components, and parts thereof; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean substrates such as semiconductor or glass substrates by blowing dust particles of the substrate surface, organic matter of the substrate surface or burrs which occur during micro-process on the substrate surface while scanning the carbon dioxide particles from the spray nozzle to the substrate; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean products such as electronic or semiconductor products by blowing dust particles of the product surface, organic matter of the product surface or burrs which occur during micro-process on the product surface while scanning the carbon dioxide particles from the spray nozzle to the product

YOU TEC SUPPORT AND SERVICE

The mark consists of the word "YOUTEC" in blue font with white shading above a blue horizontal line. Below the horizontal line and in smaller, blue font are the words "SUPPORT AND SERVICE".

(Based on Sections 1(b) and 44(e)): Process coating of semiconductor components for others using thin film synthetic polymers (Based on Section 1(b) only): Processing and assembling of electronic components for the semiconductor manufacturing industry; Processing and assembly of electronic circuits and parts thereof for others; Processing and assembly of electrical communication components for the semiconductor manufacturing industry; Processing and assembly of electronic machines for use in the semiconductor manufacturing industry; Custom manufacture of machines for manufacturing electronic semiconductor components; Custom manufacture of semiconductor manufacturing machines and parts thereof; Custom manufacture of chemical processing machines and parts thereof; Custom manufacture of metalworking machines and parts thereof; Custom manufacture of plastic processing machines and parts thereof; Custom manufacture of industrial machines used to process physical properties of matter and energy, as well as chemical properties and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for metal surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for semiconductor manufacturing and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for plastic surface processing, and parts thereof; Custom manufacture of apparatus for depositing thin film synthetic polymers by chemical vapor deposition for glass surface processing, and parts thereof; Custom manufacture of ion plating apparatus for metal surface processing and parts thereof; Custom manufacture of ion plating apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of ion plating apparatus for plastic surface processing and parts thereof; Custom manufacture of ion plating apparatus for glass surface processing and parts thereof; Custom manufacture of sputtering apparatus for metal surface processing and parts thereof; Custom manufacture of sputtering apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of sputtering apparatus for plastic surface processing and parts thereof; Custom manufacture of sputtering apparatus for glass surface processing and parts thereof; Custom manufacture of etching apparatus for metal surface processing and parts thereof; Custom manufacture of etching apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of etching apparatus for plastic surface processing and parts thereof; Custom manufacture of etching apparatus for glass surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for industrial surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for metal surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Custom manufacture of vacuum evaporation apparatus for plastic surface processing and parts thereof; Custom manufacture of vacuum evaporation apparatus for glass surface processing and parts thereof; Custom manufacture of cleaning apparatus comprising a spray nozzle connected to a liquid carbon dioxide tank, and replacement parts therefore

The mark consists of the word "YOUTEC" in blue font above a blue horizontal line. Below the horizontal line and in smaller, blue font are the words "SUPPORT" and "SERVICE".

YOU TEC SUPPORT AND SERVICE

(Based on Section 1(b) only): Electronic components, namely, semiconductor wafers for use in the manufacture of semiconductors; Semiconductor manufacturing apparatus and systems, namely, semiconductor substrates and semiconductor wafers and parts thereof; Chemical processing machines, namely, separating machines, dissolving machines, extracting machines and parts thereof; Metalworking machines, namely, boring machines, bending machines, cutting machines and parts thereof; Plastic processing machines and parts thereof; Chemical processing machines for industrial use and parts thereof; Apparatus for forming thin film coatings for use in the manufacture of semiconductors and for processing metal surfaces and insulating materials, and parts thereof; Apparatus for depositing thin film coatings on metal surfaces by chemical vapor deposition processing and parts thereof; Apparatus for forming thin films for use in the manufacture of semiconductors using a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on plastic surfaces through a chemical vapor deposition process, and parts thereof; Apparatus for forming thin films on glass surfaces by a chemical vapor deposition process, and parts thereof; Industrial apparatus for processing ion plating applications of metal surfaces and parts thereof; Industrial apparatus for processing ion plating applications for use in semiconductor manufacturing and parts thereof; Industrial apparatus for processing ion plating applications for plastic surfaces, and parts thereof; Industrial apparatus for processing ion plating applications for glass surfaces, and parts thereof; Sputtering apparatus for metal surface processing and parts thereof, for industrial use; Sputtering apparatus for semiconductor manufacturing and parts thereof; Sputtering apparatus for plastic surface processing and parts thereof, for industrial use; Sputtering apparatus for glass surface processing and parts thereof, for industrial use; Etching apparatus for metal surface processing and parts thereof, for industrial use; Etching apparatus for semiconductor manufacturing and parts thereof; Etching apparatus for plastic surface processing and parts thereof, for industrial use; Etching apparatus for glass surface processing and parts thereof, for industrial use; Vacuum evaporation apparatus for surface treatment of semiconductors and parts thereof; Vacuum evaporation processing apparatus for treatment of metal surfaces of semiconductor components, and parts thereof; Vacuum evaporation apparatus for semiconductor manufacturing and parts thereof; Vacuum evaporation apparatus for plastic surface processing of semiconductor components, and parts thereof; Vacuum evaporation processing apparatus for use on glass surfaces of semiconductor components, and parts thereof; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean substrates such as semiconductor or glass substrates by blowing dust particles of the substrate surface, organic matter of the substrate surface or burrs which occur during micro-process on the substrate surface while scanning the carbon dioxide particles from the spray nozzle to the substrate; Cleaning machines comprising a spray nozzle connected to a liquid carbon dioxide tank which utilizes carbon dioxide particles to clean products such as electronic or semiconductor products by blowing dust particles of the product surface, organic matter of the product surface or burrs which occur during micro-process on the product surface while scanning the carbon dioxide particles from the spray nozzle to the product

(Based on Sections 1(b) and 44(e)): Repair and maintenance of machines for use in the manufacture of electronic semiconductor components; Repair and maintenance of semiconductor manufacturing machines; Repair and maintenance of chemical processing machines; Repair and maintenance of metalworking machines; Repair and maintenance of plastic processing machines; Repair and maintenance of industrial machines used to process physical properties of matter and energy, as well as chemical properties; Repair and maintenance of machines for depositing thin films of synthetic polymers on semiconductors, metal surfaces and electrical insulating materials; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for metal surface; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition for semiconductor manufacturing; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for plastic surface; Repair and maintenance of apparatus for forming thin films by chemical vapor deposition process for glass surface; Repair and maintenance of ion plating apparatus for metal surface processing of semiconductor components; Repair and maintenance of ion plating apparatus for semiconductor manufacturing; Repair and maintenance of ion plating apparatus for plastic surface processing of semiconductor components; Repair and maintenance of ion plating apparatus for glass surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for metal surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for semiconductor manufacturing; Repair and maintenance of sputtering apparatus for plastic surface processing of semiconductor components; Repair and maintenance of sputtering apparatus for glass surface processing of semiconductor components; Repair and maintenance of etching apparatus for metal surface processing; Repair and maintenance of etching apparatus for semiconductor manufacturing; Repair and maintenance of etching apparatus for plastic surface processing; Repair and maintenance of etching apparatus for glass surface processing; Repair and maintenance of vacuum evaporation apparatus for use in semiconductor manufacturing; Repair and maintenance of vacuum evaporation apparatus for metal surface preprocess in semiconductor manufacturing; Repair and maintenance of vacuum evaporation apparatus for plastic surface processing of semiconductor components; Repair and maintenance of vacuum evaporation apparatus for glass surface processing of semiconductor components

YOU TEC SUPPORT AND SERVICE